Recently, there was some pretty big news in the AI semiconductor market.
Samsung Electronics and US semiconductor company Broadcom Building the Next Generation AI InfrastructureWe decided to expand cooperation for. The expected size of cooperation is Over the next 5 years More than $200 billionAs, the period is until 2030.
If you look at the amount, it looks like a huge contract, but there's something else to really pay attention to in this announcement.
Samsung Electronics doesn't just supply memory. HBM, Foundry, Advanced Packaging Served as a bundleThat I doWow.
| Is this a $200 billion definitive contract?
First, you need to distinguish it accurately.
What Samsung Electronics and Broadcom have signed is not a definitive agreement to purchase the product immediately worth $200 billion. agreements for strategic cooperation, MOUHey.
Samsung Electronics expects that through this cooperation, the amount of business to be generated in the memory and foundry fields will exceed $200 billion by 2030. Therefore, the actual size and timing of supply may vary depending on both companies' product development and production plans in the future.
If you look at the news title and understand that Samsung Electronics has $200 billion in sales right now, Slightly ExaggeratedThat's why it can be.
| What will Samsung Electronics and Broadcom make together?
This cooperation can be divided into three main categories.
> Supply of HBM for next-generation AI accelerators
Samsung Electronics has developed a next-generation AI accelerator with high-bandwidth memory, HBMWe will cooperate in the direction of supplying.
HBM is a product that speeds up data processing by stacking multiple memory chips vertically. It is used as a critical component in generative AI and data centers that need to process large amounts of data quickly.
As the size of the AI model grows, not only are computational devices Memory for fast data transfer Performance also becomes important, which is why HBM is now considered a key part of the AI semiconductor competition.
> Foundry process cooperation below 2 nanoscale
Samsung Electronics is involved in the production of Broadcom products. Foundry process below 2 nanosPromote ways to use.
Foundry A business that produces semiconductors designed by another company insteadHey. If Broadcom designs a semiconductor, Samsung Electronics produces it with a real chip using a high-tech process.
According to Samsung Electronics' official announcement, both companies plan to utilize process technology below 2 nanos in semiconductor production, including Broadcom's wireless broadband communication products.
If this cooperation leads to actual large-scale production, it will be an opportunity to secure long-term quantities with important customers even from the perspective of Samsung Foundry.
> 2.3D · 2.5D advanced packaging
The two companies are not just producing semiconductors, 2.3D and 2.5D advanced packaging technologyWe're also going to cooperate in.
Advanced packaging, like compute chips and HBM, Technology that places and connects multiple semiconductors close together to make them work like a single systemWow.
In AI semiconductors, the performance of each chip is important, but it is also important how quickly and efficiently data is exchanged between the chips. Since Samsung Electronics has both memory, foundry, and packaging, it seems that they want to integrate and provide these three areas.
| Why did Broadcom team up with Samsung Electronics?
Broadcom is not only for telecom semiconductors, but also for company-specific needs. Custom AI AcceleratorsIt's a company that designs.
Recently, large IT companies have made a move to develop dedicated semiconductors optimized for data centers with their AI services instead of using only NVIDIA's general-purpose GPUs.
To produce such customized AI semiconductors in large quantities, we need not only advanced foundry processes, but also HBM and packaging technology. From a Broadcom perspective, there are good reasons to expand the supply chain by working with Samsung Electronics, which can cover all three areas.
| What does it mean for Samsung Electronics?
This cooperation can be a three-pronged opportunity for Samsung Electronics.
First is HBM supply expansion for AI. As the AI semiconductor market grows, the demand for HBM is also increasing rapidly, so cooperation with large customers is important for the memory business.
Second is It's a customer expansion of the foundry business. If Samsung Electronics' 2nm or less process is actually applied to Broadcom products, it can be an example of high-tech foundry competitiveness.
Third is It's the only integrated supply ability of Samsung Electronics. Samsung Electronics can provide memory, foundry, and advanced packaging in one company. This cooperation can be seen as a move to fully utilize this structure in the AI semiconductor market.
| Will it affect the average user?
Smartphones or PCs don't change right away with this announcement.
This collaboration is more about AI data centers and semiconductor supply chains than consumer products. Actual product development and production are also included in the long-term plan until 2030.
However, if the performance of AI semiconductors increases and the supply stabilizes, the speed and processing efficiency of the generative AI services we use may improve in the long term.
If the cost of running an AI service is lower, we can also think about the possibility of more features being offered for free or on a cheaper plan. However, this part is expected to vary depending on the actual semiconductor production volume and the pricing policy of AI service companies.
> Still to watch
This announcement is pretty big, but it's still MOU StepsIt's important to remember that.
In fact, it has not been specifically disclosed which products will be applied to Samsung Electronics' HBM and foundry processes or how much production will be produced.
In advanced semiconductor production, process yield, product verification, and mass production schedule are also important. Therefore, whether the published expected scale leads to actual sales and supply Additional contracts and production announcementsYou have to check.
Summary
This cooperation between Samsung Electronics and Broadcom is a little different from a simple memory supply contract.
Samsung Electronics' core semiconductor technology, HBM joins forces to support next-generation AI semiconductors by bringing together sub-Nano foundries and advanced packagingWow.
This is not a confirmed $200 billion purchase contract yet, but if it leads to actual mass production, it could be an important opportunity for Samsung Electronics to expand its influence in the AI semiconductor supply chain.
In the future, it is necessary to watch which AI accelerator of Broadcom applies Samsung Electronics' technology and when the actual production of the two-nano process begins.
Hello. This time, we changed the style of the article from polite to friendly!
In the future, I will study and try many times to find the characteristics of the blog in this way.
Thank you all the time.
Tags
#Samsung Electronics #Broadcom #AI Semiconductors #HBM # Samsung Foundry #2Nano #Advanced Packaging #Artificial Intelligence #IT News # Semiconductor News
