Huawei Plans to Launch Two Next-Generation AI Chips in 2027… Competing in Ultra-Large-Scale Connectivity with UnifiedBus
Huawei has unveiled a schedule to sequentially release two next-generation AI chips in 2027. The company aims to launch the Ascend 960DT in the first quarter of 2027 and the Ascend 960PR in the third quarter of the same year. What stands out about this announcement goes beyond the individual chips. Huawei also presented its UnifiedBus technology, which bundles multiple AI processors into a single, massive computing system, as well as its “supercluster” concept, capable of connecting up to 1 million processors.





